MODELLING AND SIMULATION IN THERMAL AND CHEMICAL ENGINEERING: A BOND GRAPH APPROACH
Material type:![Text](/opac-tmpl/lib/famfamfam/BK.png)
- 660.201 13
Item type | Current library | Collection | Shelving location | Call number | Status | Date due | Barcode |
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TQP LIBRARY | MECHANICAL ENGINEERING | REFERENCE:GER:16 B | 660.201 13 (Browse shelf(Opens below)) | Available | TQP0545 |
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